"Copper Microelectrodeposition: the Influence of Different Additives on Growth in Microprofiles" Proceedings AESF SUR/FIN 2000, 26 - 29 VI, Chicago; AESF INC., Orlando FL, 2000.

"Electrodeposition of Cu/CoNi(Cu) GMR Superlattices" Proceedings 5th International Pulse Plating Symposium, AESF SUR/FIN 2000, 29 - 30 VI, Chicago; AESF INC., Orlando FL, 2000.

"Copper Electrodeposition for on-Chip Interconnections: the Role of Different Additives" Proceedings of the 3rd Symposium on Electrochemical Processing in ULSI Fabrication 197th Meeting of The Electrochemical Society; Toronto, Ontario, Canada 14 - 18 V 2000.

P.L. Cavallotti, D. Manara,R. Vallauri, A. Vicenzo, J. Machado da Silva, M.A. Sa

"GMR Effect in Electrodeposited Cu/CoNi(Cu) Multilayers", "Magnetic Materials, Processes and Devices V", L.T. Romankiw, S. Krongelb and C.H. Ahn Eds., The Electrochemical Society, 156-175, (1999).

"Sviluppi nella elettrochimica dei metalli e nella caratterizzazione dei rivestimenti - Advances in Metal Electrochemistry and Coating Characterization", AIFM Galvanotecnica e Nuove Finiture, 9, 256-268 (1999).

"GMR Effect in Electrodeposited Cu/CoNi(Cu) Multilayers", 194th Meeting of the Electrochemical Society, Boston, p.451, (1998).

"Substrate and copper layers growth influence on electrodeposited GMR multilayers" - General Student Poster Session - The Electrochemical Society 194th Meeting in Boston, Massachusetts November 1-6 1998.

The American Electroplaters and Surface Finishers Society

The American Electroplaters and Surface Finishers Society, Inc. (AESF), is an international, individual-membership, non-profit professional society. Founded in 1909, the AESF has 78 Branches and more than 7,000 members, worldwide. The Society is regarded and respected as the foremost finishing authority in the world.

The primary mission of the AESF is to advance the science of surface finishing, to benefit industry and society through education, information and social involvement.