Workshop in the ICIS 2010 Conference

ICIS stands for International Conference on Information Sciences and Interaction Sciences. It is the world's premier venue for Theory, Development, Applications, Experiences, and Evaluation of Information Sciences and Interaction Sciences. It enables the international scientific elite, both experienced scientists and promising young researchers and practicians alike to gather together to discuss their views and research findings. ICIS promotes fundamental and applied research, continuing and advanced academic education, and the transfer of knowledge between those involved in the research side and application side of Information Sciences and Interaction Sciences. The conference brings together internationally renowned leading scientists for the purpose of exploring a cutting-edge Information Sciences and Interaction Sciences topics. The friendly and open climate at the conference promotes a culture of communication and exchange among the participants. ICIS 2010 will take place in Chengdu, China, 23-25 June, 2010.


URL: http://www.aicit.org/icis


Aims and Scope of DATICS-ICIS’10 Workshop

DATICS Workshops were initially created by a network of researchers and engineers both from academia and industry in the areas of Design, Analysis and Tools for Integrated Circuits and Systems. Recently, DATICS has been extended to the fields of Communication, Computer Science, Software Engineering and Information Technology.


The main target of DATICS-ICIS’10 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all aspects of DATICS.



Topics

Topics of interest include, but are not limited to, the following:



Circuits, Systems and Communications:

  • digital, analog, mixed-signal, VLSI, asynchronous and RF design
  • processor and memory
  • DSP and FPGA/ASIC-based design
  • synthesis and physical design
  • embedded system hardware/software co-design
  • CAD/EDA methodologies and tools
  • statistical timing analysis and low power design methodologies
  • network/system on-a-chip and applications
  • hardware description languages, SystemC and SystemVerilog
  • simulation, verification and test technology
  • semiconductor devices and solid-state circuits
  • fuzzy and neural networks
  • communication signal processing
  • mobile and wireless communications
  • multimedia communications

Computer Science, Software Engineering and Information Technology:

  • equivalence checking, model checking, SAT-based methods, compositional methods and probabilistic methods
  • graph theory, process algebras, petri-nets, automaton theory, BDDs and UML
  • formal methods
  • distributed, real-time and hybrid systems
  • reversible computing and biocomputing
  • software architecture and design
  • software testing and analysis
  • software dependability, safety and reliability
  • programming languages, tools and environments
  • face detection and recognition
  • database and data mining
  • image and video processing
  • watermarking
  • artificial intelligence
  • average-case analysis and worst-case analysis
  • design and programming methodologies for network protocols and applications
  • coding, cryptography algorithms and security protocols
  • evolutionary computation
  • numerical algorithms


Chairman

  • Dr. Ka Lok Man, Xi’an Jiaotong-Liverpool University (China - UK) and CEOL, University College Cork (Ireland)


International Program Committee

  • Prof. Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
  • Prof. Paolo Prinetto, Politecnico di Torino, Italy
  • Prof. Massimo Poncino, Politecnico di Torino, Italy
  • Prof. Alberto Macii, Politecnico di Torino, Italy
  • Prof. Joongho Choi, University of Seoul, South Korea
  • Prof. Wei Li, Fudan University, China
  • Prof. Michel Schellekens, University College Cork, Ireland
  • Dr. Emanuel Popovici, University College Cork, Ireland
  • Dr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
  • Dr. Umberto Rossi, STMicroelectronics, Italy
  • Prof. Franco Fummi, University of Verona, Italy
  • Dr. Graziano Pravadelli, University of Verona, Italy
  • Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong
  • Dr. Vladimir PavLov, International Software and Productivity Engineering Institute, USA
  • Ajay Patel, Intelligent Support Ltd, United Kingdom
  • Dr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, The Netherlands
  • Dr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
  • Dr. Menouer Boubekeur, University College Cork, Ireland
  • Dr. Ana Sokolova, University of Salzburg, Austria
  • Dr. Sergio Almerares, STMicroelectronics, Italy
  • Monica Donno, Minteos, Italy
  • Prof. Jun-Dong Cho, Sung Kyun Kwan University, South Korea
  • Prof. AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
  • Prof. Gregory Provan, University College Cork, Ireland
  • Dr. Miroslav N. Velev, Aries Design Automation, USA
  • Prof. M. Nasir Uddin, Lakehead University, Canada
  • Dr. Alexei Botchkarev, IEEE Canada Board of Directors
  • Dr. Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
  • Dr. Dave Hickey, University College Cork, Ireland
  • Dr. Maria O’Keeffe, University College Cork, Ireland
  • Dr. Tomas Krilavičius, Vytautas Magnus University, Lithuania
  • Dr. Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
  • Dr. John Herbert, University College Cork, Ireland
  • Prof. Zhe-Ming Lu, Sun Yat-Sen University, China
  • Prof. Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
  • Prof. Chin-Chen Chang, Feng Chia University, Taiwan
  • Prof. Mong-Fong Horng, Shu-Te University, Taiwan
  • Prof. Liang Chen, University of Northern British Columbia, Canada
  • Prof. Chee-Peng Lim, University of Science Malaysia, Malaysia
  • Prof. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, Vietnam
  • Dr. Salah Merniz, Mentouri University, Constantine, Algeria
  • Dr. Oscar Valero, University of Balearic Islands, Spain
  • Prof. Yang Yi, Sun Yat-Sen University, China
  • Dr. Damien Woods, University of Seville, Spain
  • Dr. Franck Vedrine, CEA LIST, France
  • Prof. Bruno Monsuez, ENSTA, France
  • Prof. Kang Yen, Florida International University, USA
  • Prof. Takenobu Matsuura, Tokai University, Japan
  • Dr. R. Timothy Edwards, MultiGiG, Inc., USA
  • Dr. Olga Tveretina, Karlsruhe University, Germany
  • Dr. Maria Helena Fino, Universidade Nova De Lisboa, Portugal
  • Dr. Adrian Patrick O’Riordan, University College Cork, Ireland
  • Dr. Grzegorz Labiak, University of Zielona Gora, Poland
  • Dr. Jian Chang, Texas Instruments, Inc, USA
  • Prof. Yeh-Ching Chung, National Tsing-Hua University, Taiwan
  • Dr. Anna Derezinska, Warsaw University of Technology, Poland
  • Prof. Kyoung-Rok Cho, Chungbuk National University, South Korea
  • Dr. Yong Zhang, Shenzhen University, China
  • Dr. R. Liutkevičius, Vytautas Magnus University, Kaunas, Lithuania
  • Dr. Yuanyuan Zeng, University College Cork, Ireland
  • Dr. D.P. Vasudevan, University College Cork, Ireland
  • Dr. Arkadiusz Bukowiec, University of Zielona Gora, Poland
  • Dr. Paris Kitsos, Hellenic Open University, Patras, Greece
  • Dr. Maziar Goudarzi, University College Cork, Ireland
  • Prof. Jin Song Dong, National University of Singapore, Singapore
  • Prof. Dhamin Al-Khalili, Royal Military College of Canada, Canada
  • Prof. Zainalabedin Navabi, University of Tehran, Iran
  • Prof. Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
  • Prof. Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan
  • Dr. Deepak Laxmi Narasimha, University of Malaya, Malaysia
  • Dr. Danny Hughes, Xi’an Jiaotong-Liverpool University, China
  • Dr. Emmanuel M Tadjouddine, Xi’an Jiaotong-Liverpool University, China
  • Dr. Jun Wang, Fujitsu Laboratories of America, Inc., USA
  • Prof. A.P.Sathish Kumar, PSG Institute of Advanced Studies, India
  • Prof. N.Jaisankar, VIT University. India
  • Dr. Graham Dawson, Suzhou Institute of Nano-tech and Nano-bionics (SINANO), China
  • Prof. Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan
  • Steven Hollands, Synopsys, Ireland
  • Dr. Siamak Mohammadi, University of Tehran, Iran
  • Dr. Felipe Klein, State University of Campinas (UNICAMP), Brazil
  • Dr. Enggee Lim, Xi’an Jiaotong-Liverpool University, China


International Reviewers

  • Peter Westermann, Technical University of Dortmund, Germany
  • Tom English, University College Cork, Ireland
  • Miquel Moreto Planas, Technical University of Catalonia, Spain
  • Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
  • Chi-Un Lei, University of Hong Kong, Hong Kong
  • Sean Harte, Tyndall, University College Cork, Ireland
  • Alexander Yin, University of Turku, Finland
  • Luigi Giancardi, Università degli Studi di Genova, Italy
  • Alie El-Din Mady, University College Cork, Ireland
  • Prasad D. Khandekar Vishwakarma Institute of Information Technology, Pune
  • Hari Mohan Pandey, SVKM's NMIMS University, India
  • Vishal Bharti, Dronacharya College of Engineering, Khentawas, Gurgaon, India


Organising Chairs

  • Dr. Monica O’Mullane, University College Cork, Ireland
  • Michele Mercaldi, Minteos, Italy
  • Chen Chen, Global Institute of Software Technology, China


Paper Submissions, Proceedings, Indexing, Journal Publications and Book Chapters

  • All submitted papers should be in the form of .pdf and are to be limited to a maximum length of 8 pages (A4 size, single space, Times Roman of font size 10, two columns format), including figures, tables and references.
  • There is no template for the initial paper.
  • Please submit full papers using the EasyChair DATICS-ICIS'10 Webpage at http://www.easychair.org/conferences/?conf=daticsicis10.
  • If the paper(s) is/are accepted for publication, at least one of the authors of the accepted paper(s) must register to the DATICS-ICIS’10 Workshop through the hosting conference ICIS’10. Details of the registration can be found at http://www.aicit.org/icis.
  • Please note that all accepted papers in DATICS-ICIS’10 will be included in the ICIS’10 conference proceeding published by IEEE (The proceedings will be included in EI and other index). After conference, several special issues of international journals such as IJDATICS will be arranged for selected papers.


DATICS-ICIS’10 Review Process

DATICS-ICIS’10 consists of about 80 experts in the related fields of DATICS both from academia and industry. Each submission will be sent to at least 2 members of the DATICS IPC and additional reviewers for review.


Important Deadlines

  • Deadline for full paper submission: 15 April 2010
  • Notification of acceptance: 26 April 2010


Becoming a Sponsor of DATICS-ICIS’10

For information, please contact ss.datics@gmail.com.


Technical Committee

If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to ss.datics@gmail.com.


Enquiries