DATICS-ICMS'09

Design, Analysis and Tools for Integrated Circuits and Systems (DATICS'09)

Workshop in the International Conference of Mathematical Sciences

The International Conference of Mathematical Sciences 2009 (ICMS 2009) is organised by the Maltepe University, Turkey. ICMS 2009 will take place in Istanbul, Turkey, 4-10, August, 2009.
URL: http://mathsciencesconf.maltepe.edu.tr/

Aims and Scope

Main target of the Workshop: DATICS'09 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all areas of design, analysis and tools for integrated circuits (e.g. digital, analog and mixed-signal circuits) and systems (e.g. real-time, hybrid and embedded systems). DATICS'09 also focuses on the fields of formal methods, low power design methodologies for integrated circuits and wireless sensor networks (WSNs).

Topics

Topics of interest include, but are not limited to, the following:

• digital, analog, mixed-signal and asynchronous design
• processor, memory and RF design
• DSP and FPGA/ASIC-based design
• synthesis and physical design
• ATPG, design-for-testability and built-in self test methodologies
• embedded system hardware/software co-design and co-verification
• CAD/EDA methodologies and tools
• statistical timing analysis and low power design methodologies
• network and system on-a-chip and applications
• communication and wireless sensor networks (WSNs)
• specification languages: SystemC, SystemVerilog and UML
• theory and foundations: model checking, SAT-based methods, use of PSL, compositional methods and probabilistic methods
• applications of formal methods: equivalence checking, CSP applications and transaction-level verification
• verification methods based on hardware description/system-level languages (e.g. VHDL, SystemVerilog and SystemC)
• industrial experience reports and case studies
• real-time, hybrid and embedded systems
• all areas of modelling, simulation and verification of systems
• formalisms: process algebras, petri-nets, automaton theory and BDDs
• software engineering (including real-time Java, real-time UML and performance metrics)
• reversible computing

Industrial Collaborators and Sponsors

The workshop is partnered with:

1. CEOL: Centre for Efficiency-Oriented Languages "Towards improved software timing", University College Cork, Ireland (http://www.ceol.ucc.ie)
2. International Software and Productivity Engineering Institute, USA (http://www.intspei.com)
3. Intelligent Support Ltd., United Kingdom (http://www.isupport-ltd.co.uk)
4. Minteos, Italy (http://www.minteos.com)
5. M.O.S.T., Italy (http://www.most.it)
6. Electronic Center, Italy (http://www.el-center.com)
7. Legalefiscale - Tax & Commercial Law Firm, Italy (http://www.legalefiscale.it)

This workshop is sponsored by:

1. LS Industrial Systems, South Korea (formerly LG Industrial Systems) - http://eng.lsis.biz
2. Solari, Hong Kong (official sales agent of Sanyo LCD camera modules) - http://www.solari-hk.com

Organiser - Chairman

• Dr. Ka Lok Man, University College Cork, Ireland
• Eng. Michele Mercaldi, M.O.S.T., Italy

International Program Committee

• Prof. Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
• Prof. Paolo Prinetto, Politecnico di Torino, Italy
• Prof. Massimo Poncino, Politecnico di Torino, Italy
• Prof. Alberto Macii, Politecnico di Torino, Italy
• Prof. Joongho Choi, University of Seoul, South Korea
• Prof. Wei Li, Fudan University, China
• Prof. Michel Schellekens, University College Cork, Ireland
• Dr. Emanuel Popovici, University College Cork, Ireland
• Dr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
• Dr. Umberto Rossi, STMicroelectronics, Italy
• Prof. Franco Fummi, University of Verona, Italy
• Dr. Graziano Pravadelli, University of Verona, Italy
• Yui Fai Lam, Manager, Mircosystems Packaging Institute, University of Science and Technology, Hong Kong
• Dr. Vladimir PavLov, International Software and Productivity Engineering Institute, USA
• Ajay Patel, Director, Intelligent Support Ltd, United Kingdom
• Dr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, Advanced Research Center, The Netherlands
• Dr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
• Dr. Menouer Boubekeur, University College Cork, Ireland
• Dr. Ana Sokolova, University of Salzburg, Austria
• Dr. Sergio Almerares, STMicroelectronics, Italy
• Monica Donno, Director, Minteos, Italy
• Prof. Jun-Dong Cho, Sung Kyun Kwan University, South Korea
• Prof. AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
• Prof. Gregory Provan, University College Cork, Ireland
• Dr. Miroslav N. Velev, Aries Design Automation, USA
• Prof. M. Nasir Uddin, Lakehead University, Canada
• Dr. Alexei Botchkarev, IEEE Canada Board of Directors
• Dr. Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
• Dr. Dave Hickey, University College Cork, Ireland
• Dr. Tomas Krilavičius, Vytautas Magnus University, Lithuania
• Dr. Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
• Dr. John Herbert, University College Cork, Ireland
• Prof. Zhe-Ming Lu, Sun Yat-Sen University, China
• Prof. Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
• Prof. Chin-Chen Chang, Feng Chia University, Taiwan
• Prof. Mong-Fong Horng, Shu-Te University, Taiwan
• Prof. Liang Chen, University of Northern British Columbia, Canada
• Prof. Chee-Peng Lim, University of South Australia, Australia
• Prof. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, Vietnam
• Prof. Suash Deb, C. V. Raman College of Engineering, India
• Dr. Salah Merniz, Mentouri University, Constantine, Algeria
• Dr. Oscar Valero, University of Balearic Islands, Spain
• Prof. Yang Yi, Sun Yat-Sen University, China
• Dr. Damien Woods, University of Seville, Spain
• Dr. Franck Vedrine, CEA, France
• Prof. Bruno Monsuez, ENSTA, France
• Prof. Kang Yen, Florida International University, USA
• Prof. Takenobu Matsuura, Tokai University, Japan
• Dr. R. Timothy Edwards, MultiGiG, Inc., USA
• Dr. Olga Tveretina, Karlsruhe University, Germany
• Dr. Maria Helena Fino, Universidade Nova De Lisboa, Portugal
• Dr. Adrian Patrick O'Riordan, University College Cork, Ireland
• Dr. Grzegorz Labiak, University of Zielona Gora, Poland
• Prof. M.S. Gaur, Malaviya National Institute of Technology, Jaipur, India
• Dr. Jian Chang, Texas Instruments, Inc, USA
• Dr. Maria O'Keeffe, University College Cork, Ireland
• Prof. Yeh-Ching Chung, National Tsing-Hua University, Taiwan
• Dr. Anna Derezinska, Warsaw University of Technology, Poland
• Prof. Kyoung-Rok Cho, Chungbuk National University, Korea
• Dr. Yong Zhang, Shenzhen University, China
• Dr. R. Liutkevicius, Vytautas Magnus University, Kaunas, Lithuania
• Dr. Yuanyuan Zeng, University College Cork, Ireland
• Dr. Arkadiusz Bukowiec, University of Zielona Gora, Poland
• Dr. D.P.Vasudevan, University College Cork, Ireland
• Dr. Paris Kitsos, Hellenic Open University, Patras, Greece
• Dr. Maziar Goudarzi, University College Cork, Ireland
• Prof. Jin Song Dong, National University of Singapore, Singapore

International Reviewers

• Peter Westermann, Technical University of Dortmund, Germany
• Tom English, University College Cork, Ireland
• Miquel Moreto Planas, Technical University of Catalonia, Spain
• Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
• Amlan Chakrabarti, University of Calcutta, India
• Chi-Un Lei, The University of Hong Kong, Hong Kong
• Mohamed Bamakhrama, ST-NXP Wireless, The Netherlands
• B. Rajendra Naik, Osmania University, India
• Felipe Klein, State University of Campinas (UNICAMP), Brazil
• Sean Harte, Tyndall, University College Cork, Ireland
• Jun Wang, University College Cork, Ireland
• Alexander Yin, University of Turku, Finland
• Luigi Giancardi, Università degli Studi di Genova, Italy
• Alie El-Din Mady, University College Cork, Ireland
• Arun Joseph, IBM Systems and Technology Laboratory, India

Paper Submissions, Proceedings and Journal Publications

• All submitted papers should be in the form of .pdf and are to be limited to a maximum length of 6 pages (A4 size, single space, Times Roman of font size 10, two columns format), including figures, tables and references.
• There is no template for the initial paper.
• Please submit full papers using the EasyChair DATICS-ICMS'09 Webpage at http://www.easychair.org/conferences/?conf=daticsicms09.
• If the paper(s) is/are accepted for publication, at least one of the authors of the accepted paper(s) must register to the DATICS-ICMS'09 workshop through the hosting conference ICMS'09. Details of the registration can be found at http://mathsciencesconf.maltepe.edu.tr/node/15
• The accepted papers in DATICS'09 will be published electronically by IJDATICS (ISSN: 2071-2987).
• All abstracts of the accepted papers in DATICS'09 will also be included in the ICMS conference proceedings (if the authors register for the ICMS'09 conference by 31 May 2009).
• Expanded and enhanced versions of accepted papers in DATICS'09 can also be considered for inclusion in one of the IAENG journals, the IIUM Engineering Journal, the IBSU Scientific Journal or the IJDATICS Journal.

DATICS Review Process

DATICS'09 consists of about 70 experts in the related fields of DATICS both from academia and industry. Each submission will be sent to at least 2 members of the DATICS IPC and additional reviewers for review.

Important Deadlines

• Deadline for full paper submission: 15 June 2009
• Notification of acceptance: 7 July 2009
• Deadline for authors' registration: 15 July 2009

Becoming a Sponsor of DATICS'09

For information, please contact ss.datics@gmail.com.

Technical Committee

If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to ss.datics@gmail.com.

Enquiries

Please direct all enquiries to ss.datics@gmail.com.